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LED aluminum substrate

LED aluminum substrate
Product parameters

Introduction:The aluminum substrate (metal based heat dissipation plate (including aluminum substrate, copper substrate and iron substrate) is a low alloyed Al Mg Si series high plastic alloy plate (see the figure below for structure), which has good thermal conductivity, electrical insulation and mechanical processing performance. Compared with the traditional FR - 4, the aluminum substrate has the same thickness, the same line width, and can carry higher current. The withstand voltage of the aluminum substrate can reach 4500V, and the thermal conductivity is greater than 2.0, In the industry, aluminum substrate is mainly used.

Describe

characteristic:
The aluminum substrate (metal based heat dissipation plate (including aluminum substrate, copper substrate and iron substrate) is a low alloyed Al Mg Si series high plastic alloy plate (see the figure below for structure), which has good thermal conductivity, electrical insulation and mechanical processing performance. Compared with the traditional FR - 4, the aluminum substrate has the same thickness, the same line width, and can carry higher current. The withstand voltage of the aluminum substrate can reach 4500V, and the thermal conductivity is greater than 2.0, In the industry, aluminum substrate is mainly used.
 ●Use surface mounting technology (SMT);
 ●In the circuit design, the thermal diffusion is treated effectively;
 ●Reduce product operating temperature, improve product power density and reliability, and extend product service life;
 ●Reduce product volume and hardware and assembly costs;
 ●Replace fragile ceramic substrate to obtain better mechanical durability.
Structure: aluminum base copper clad plate is a metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:
 Cireuitl.Layer circuit layer: it is equivalent to the copper clad plate of ordinary PCB, and the thickness of circuit copper foil is loz to 10oz.
 DielcctricLayer insulating layer: The insulating layer is a layer of low thermal resistance thermal conductive insulating material. Thickness: 0.003 "to 0.006" inch is the core technology of aluminum based copper clad laminate, which has obtained UL certification. BaseLayer base course: It is a metal substrate, generally aluminum or optional copper. Aluminum based copper clad laminate and traditional epoxy glass cloth laminate.
 Compared with other materials, PCB materials have incomparable advantages. It is suitable for surface mounting SMT technology of power components.
 No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good.
Use of aluminum substrate: power hybrid IC (HIC)[1] 。
 Audio equipment: input, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc.
 Power supply equipment: switch regulator ` DC/AC converter ` SW regulator, etc.
 Communication electronic equipment: high frequency amplifier, filter apparatus and sending circuit.
 Office automation equipment: motor driver, etc.
 Automobile: electronic regulator, igniter, power controller, etc.
 Computer: CPU board, floppy disk drive, power supply device, etc.
 Power module: inverter, solid relay, rectifier bridge, etc.
Lamps and lanterns: With the promotion of energy-saving lamps, various energy-saving and colorful LED lamps are popular in the market, and aluminum substrates used for LED lamps have also begun to be widely used.
The aluminum substrate can be divided into tin sprayed aluminum substrate, aluminum oxide resistant substrate, silver plated aluminum substrate, gold plated aluminum substrate, etc. according to the process; It can be divided into: street lamp aluminum substrate, fluorescent lamp aluminum substrate, LB aluminum substrate, COB aluminum substrate, packaging aluminum substrate, bulb lamp aluminum substrate, power supply aluminum substrate, automobile aluminum substrate, etc.
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Dongguan Xulian Electronic Technology Co., Ltd

Telephone:0769-87980772   Fax:0769-87988687   Filing No:Yue ICP Bei No. 2022124356

Keywords: synthetic stone, wave soldering fixture, reflow soldering fixture, mold insulation plate, plastic mold, fixture, electronic materials, high temperature resistant materials, engineering materials


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